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Tuesday, June 20 • 9:00am - 3:00pm
Full Day Pre-Con Workshop: Printed, Flexible, Stretchable and Functional/ E-Fabric Sensors and Sensor-Based Systems: Technology Launchpads to Enable Emerging Applications

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9:00-9:05 Welcome
Speaker: Roger Grace, President, Roger Grace Associates, Workshop Organizer and Chairman

9:05-9:25 Introduction and Overview of Printed, Flexible, Stretchable and Functional/E-Fabric Sensors and Sensor-Based Systems
Speaker: Roger Grace, President, Roger Grace Associates

9:25-9:50 Keynote: High-Performance Printed Electronics on Flexible Substrates
Speaker: Ravinder Dahiya Ph.D., Northeastern University

9:50-10:10 Design Considerations when Embedding Tactile Force Sensors-What OEMs Need to Know
Engineers designing commercial products always have key considerations in mind when it comes to specifying embedded components: performance, budget, and timing. Every application is unique, and experienced engineers know that these factors are not mutually exclusive – selecting the “right” component doesn’t always mean selecting the highest precision component, and selecting the most cost-effective component doesn’t always mean selecting the component with the lowest piece-price.This presentation will provide examples of applications in industries ranging from healthcare to automotive, highlighting critical information to consider in evaluating embedded technology like thin, flexible force sensors.
Speaker: Rob Podoloff, Chief Technology Officer, Tekscan

10:10-10:30 Conventional versus New Generation Gas Sensing: Meeting the Demanding Needs of Flexible Electronics and Emerging Markets
Conventional gas sensors are designed as zero-order analytical instruments with a single-output response (e.g. resistance, current, light intensity). Under variable ambient conditions such sensors suffer from cross-sensitivity from interferent gases and from fluctuations (drift) of their response because single-output sensor designs mathematically do not allow gas-selectivity and/or drift correction. In this talk, we will break this status quo by demonstrating a new generation of gas sensors, known as multivariable sensors with several independent responses. By our designs, these sensors are first-order analytical instruments. We will show that individual first-order gas sensors quantify several gases and reject interferences, which is mathematically not feasible using conventional sensor designs.
Speaker: Radislav Potyrailo Ph.D., Principal Scientist, GE Research

10:30-10:45 Morning Break

10:45-11:05 3D Printing Enables Complex Manufacturing Processes for Sensors
The convergence of 3D printing and MEMS will be covered in this presentation. MEMS wafer processing is now using Additive Manufacturing (AM) to fabricate complex micromachined substrates. By using 3D printing, hundreds of traditional MEMS wafer fabrication steps can be eliminated from the typical MEMS wafer process. Wafer level packaging cavities, through wafer vias, cantilevers, resonators, getters, pressure diaphragms and suspended microtubes have all been 3D printed as part of a wafer. The convergence of 3D printing and traditional IC and MEMS photolithography processes offers new ways to manufacture complex micromachined substrates from new materials like stainless steel, super alloys and various plastics with submicron circuit and sensing element features on the MEMS wafer surface.
Speaker: Doug Sparks Ph.D., Founder, Micro2Nano Technologies,

11:05:11:25 Additive Hybrid Electronics for Novel Wearable Devices
Flexible Hybrid Electronics (FHE) combines various processes from industries such as conventional electronics manufacturing, printing, plastics processing, additive manufacturing, laser imaging, and robotic assembly. It combines thinned dies, printed components, flexible and conformal materials for electronics to enable new shapes and form factors. NextFlex, as a consortium and a manufacturing hub, unites a broad community of technology providers, end users, and a unique combination of manufacturing tools that together make FHE possible. Additive processes enable us to erase the boundaries between advanced packaging and circuit boards. This talk provides an overview of projects at NextFlex and its partners that facilitate US manufacturing innovation for electronics packaging and integration.
Speaker: Robert Malakhov, Ph.D, Materials and Process Engineer, Netflex

11:25-11:45 Sensor Infused Smart Sock for Medical Monitoring Applications
In the last years wearable technologies and smart fabrics are arousing a great deal of interest in the healthcare field. The possibility to directly interact and collect data from the body, along with the comfort of fabrics, represent great opportunities to develop health related applications. Smart sensing socks, able to collect kinematic and foot pressure signals, are attractive solutions to perform gait analysis inside and also outside clinical laboratories, e.g., in the home environment for remote continuous monitoring of patients. In this study we analyze the performance of Sensoria smart socks in detecting the major spatio-temporal gait analysis metrics. We validate the results provided by the system in comparison with those of the IMU-based gait analysis system OPAL Mobility Lab by APDM.
Speaker: Maurizio Macagno, Co-Founder & CTO, Sensoria Health

11:45-12:00 Q & A

12:00-1:00 Lunch

1:00-1:10 Welcome
Speaker: Roger Grace, President, Roger Grace Associates, Workshop Organizer and Chairman

1:10-1:35 Self-Sustainable Textile Sensor Power Sources Based on Low-Cost Printing 
Flexible and comfortable textile embedded physical sensors capable of both energy harvesting and self-powered sensing are vital to the rapid advancements in wearable electronics. New energy-harvesting sensing systems are essential to overcome the limitations of the battery capacity, the device and product design, and the need to trade-off functionality and endurance for product size. We have developed a promising alternative to overcome these limitations relies on flexible conductor adhesives and electronic inks directly printed on textiles. The integration of versatile TENG and RF technology into functional electronic textiles brings more possibilities for next-generation wearable electronics, personal healthcare, and human–machine interfaces.
Speaker: Helena Alves Ph.D., INESC

1:35 -1:55 Sensored Soldier at the Tactical Edge
Our world is full of data, but not all of it is meaningful or useful depending on the context in which it is presented. Being able to collect and make sense of that data so that it becomes actionable information will be the key to mission success in our future military operating environment. Innovations in flexible, functional fabric and e-textile sensors and electronics will help the military realize this next phase of operations in a data-rich environment, enabling scalable continuous data collection and utilization to empower our leaders to make data-driven decisions.
Speaker: Stephanie A.T. Brown, U.S. Army Combat Capabilities Development Command

1:55 -2:15 E-Textile Based Systems for Damage Detection and Status Monitoring for Military and Other Applications
DCS has extensive experience with the development, testing and production of wearable electronic systems for military applications. This expertise is especially pertinent to textile-based sensor systems as DCS has developed an E-textile for damage detection and status monitoring with a resolution of 2-3 nodes per square inch. These sensors can target several directions of stretch or distortion in one membrane. By using a variety of colors and leveraging the inherent sheerness of the material they can make them nearly invisible.
Speaker: Sean Garbarino, Electrical Engineer, DCS,

2:15-2:35 Summary and Conclusions of Printed, Flexible, Stretchable and Functional/E-Fabric Sensors and Sensor-Based Systems
Speaker: Roger Grace, President, Roger

avatar for Roger Grace

Roger Grace

President, Roger Grace Associates
Roger H. Grace is president of Roger Grace Associates (Bonita Springs, Florida) which he founded in 1982 and which provides a broad spectrum of marketing consulting services including market research, integrated marketing communications and new business development to the sensor... Read More →
avatar for Helena Alves Ph.D

Helena Alves Ph.D

Group Leader of Organic Electronics, INESC
Helena Alves obtained her PhD in 2004, from Lisbon Technical University, Portugal, on organic semiconductors, metals and superconductors. After two years as a post-doc at the same University, she moved to Delft University of Technology, in the Netherlands, for two years as a guest... Read More →
avatar for Stephanie  A.T. Brown

Stephanie A.T. Brown

Enhanced Soldier Program Manager, U.S. Army Combat Capabilities Development Command
Stephanie Brown is the Enhanced Soldier Program Manager for the U.S. Army Combat Capabilities Development Command Soldier Center. She earned a M.S. in Human Systems Integration from the Naval Postgraduate School, and a B.S. in Design and Environmental Analysis from Cornell University... Read More →
avatar for Ravinder Dahiya Ph.D.

Ravinder Dahiya Ph.D.

Northeastern University
Ravinder Dahiya is Professor in the Department Electrical and Computer Engineering at Northeastern University, Boston, USA. His group (Bendable Electronics and Sustainable Technologies (BEST)) conducts research in flexible printed electronics, electronic skin, and their applications... Read More →
avatar for Sean Garbarino

Sean Garbarino

Electrical Engineer, DCS
Sean Garbarino is an Electrical Engineer who has been working in the government contracting research and development space for the past 5 years. After graduating from Rochester Institute of Technology with his Bachelors, he started with more hardware focused development to support... Read More →
avatar for Maurizio Macagno

Maurizio Macagno

CTO and Co-Founder, Sensoria Health
Maurizio (Mac) is a former software professional with over 20 years of development and technical program management experience in various technologies and industries. He joined Microsoft Italy in 1999, where he worked for 6 years as a consultant and solution architect for top Italian... Read More →
avatar for Robert Malakhov, Ph.D.

Robert Malakhov, Ph.D.

Materials and Process Engineer, NextFlex
Dr. Robert Malakhov is a Materials and Processing Engineer at NextFlex working on applying the latest developments in inks and substrates and additive methods to develop flexible hybrid electronics (FHEs). He earned his Ph.D. in Nanoscience and Microsystems Engineering from the University... Read More →
avatar for Rob Podoloff

Rob Podoloff

Chief Technology Officer, Tekscan
Rob Podoloff has spent the last 30 years developing new products and technologies in areas ranging from healthcare to interactive gaming to consumer electronics. Rob is a listed inventor on over 20 US Patents and is currently the Chief Technology Officer at Tekscan, the tactile sensor... Read More →
avatar for Radislav 	Potyrailo Ph.D.

Radislav Potyrailo Ph.D.

Principal Scientist, GE Research
Dr. Radislav A. Potyrailo is a Principal Scientist at GE Research. He directs programs on innovative multi-response sensors for diverse applications and brings his sensors from laboratory feasibility to field validations and to commercialization.  His 150+ granted US Patents and... Read More →
avatar for Doug Sparks Ph.D

Doug Sparks Ph.D

Founder, Micro2Nano Technologies
Dr Douglas Sparks is the founder of M2N Technologies LLC. M2N Technologies is a consulting firm specializing in the MEMS and semiconductors technology, product and process commercialization and supply chains. Dr. Sparks has international business experience in these fields in the... Read More →

Tuesday June 20, 2023 9:00am - 3:00pm PDT
Grand Ballroom F