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Wednesday, June 21 • 2:00pm - 2:20pm
Assembly Processes for Advanced MEMS Integration

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Heterogenous integration of MEMS devices brings along its own set of challenges and constraints. While the digital world can simply solve the classic 'putting 10lbs in a 5lb bag' problem, MEMS Package Integration becomes a bit more complex. This discussion will highlight some of the challenges integrating MEMS, their solutions and the specific areas to avoid while advancing the MEMS package Solution.
Speakers
avatar for Richard Otte

Richard Otte

President & CEO, Promex and QP Technologies
Mr. Otte has been President & CEO of Promex Industries Inc. since 1995.Prior to that he was the General Manager of AMP’s Kaptron Optic Products Subsidiary and President of Advanced Packaging Systems, a Raychem-Corning Joint Venture. Mr. Otte was an electronic engineer early in his... Read More →

Wednesday June 21, 2023 2:00pm - 2:20pm PDT
Grand Ballroom G
  Conference Session